[¼ÒÇü Áø°ø ¸®Ç÷οì] Áø°ø °íÈ¿À² Àåºñ VC 2
Void Á¦°Å/ Fluxless Reflow SolderingÀ» À§ÇÑ Lab. QC, R&D, ½Å·Ú¼º, ½Å¼ÒÀç °³¹ßµî¿¡ ³Î¸® »ç¿ëµÇ´Â ÄÞÆÑÆ®ÇÑ »çÀÌÁîÀÇ Áø°ø ¸®Ç÷οì.
¡Û ½Ç½Ã°£ ¸ð´ÏÅ͸µ.
¡Û Àüü ÇÁ·Î¼¼½º °ü·Ã µ¥ÀÌÅÍ ÀúÀå/ºÐ¼®.
¡Û ºü¸¥ Äð¸µÀ» À§ÇÑ ¿öÅÍ Ä¥·¯ ( Chiller ) ½Ã½ºÅÛ ±âº» Á¦°ø.
¡Û ±âº» Red copper plate with special treatment Ç÷¹ÀÌÆ®.
¡Û ½Ç½Ã°£ ¿Âµµ ±×·¡ÇÁ ¹× Áø°øµµ¸¦ µ¿½Ã ·¹ÄÚµù / µð½ºÇ÷¹ÀÌ(op).
¡Û Ư¼ö Ç÷¹ÀÌÆ® ¼±Åð¡´É (Red copper/Graphite / Graphite with SIC Ç¥¸éó¸®)
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Max 450¡É / Æ÷¸§»ê N2 Áö¿ø / ¼ö³Ã½Ä Ä¥·¯½Ã½ºÅÛ
º» VC2 Á¦Ç°Àº Void °¨¼Ò¸¦ À§ÇÑ Áø°ø ¸®ÇÃ·Î¿ì ¼Ö´õ¸µ(Reflow Soldering)°ú Ç÷°½º¸®½º ¼Ö´õ¸µ(Fluxless Soldering)À» ÅëÇØ, º¸´Ù ¿Ïº®ÇÑ ¼Ö´õ¸µ ±¸ÇöÀÌ °¡´ÉÅä·Ï ÇÕ´Ï´Ù.
Ç°ÁúÀÇ ¿ì¼ö¼ºÀ¸·Î »ç¿ëÀÌ ÇÊ¿äÇϳª, ³ôÀº °¡°Ý´ë·Î ÀÎÇØ µµÀÔÀÌ ¾î·Á¿î Áø°ø ¸®Ç÷οì (Vacuum Reflow) Ư¼ºÀ» ÇØ°áÇÑ "°æÁ¦ÀûÀÎ"°¡°ÝÀÇ Áø°ø¸®ÇÃ·Î¿ì ¸ðµ¨ VC2 ÀÔ´Ï´Ù.
VC 2 ¸®Ç÷οì´Â °æÁ¦ÀûÀÎ °¡°ÝÀ¸·Î °í°´ÀÇ Á¢±Ù¼ºÀ» ³ô¿©, °íÇ°Áú Áø°ø ¸®ÇÃ·Î¿ì ½Ã½ºÅÛÀÇ µµÀÔÀÌ ´õ¿í ¿øÈ°Çϵµ·Ï Áö¿øÇÕ´Ï´Ù. ÃÖ´ë 450µµ È÷ÆÃÀÌ °¡´ÉÇϸç, º°µµ ÁÖ¹®Á¦ÀÛ ½Ã, 600¡É±îÁö Á¦ÀÛ°¡´ÉÇÕ´Ï´Ù.
Á¦Ç° ¿ä¾à
1. ¼Ö´õ¸µ »çÀÌÁî : 200 x 200mm
2. ÃÖ´ë¿Âµµ : 450 ¡É
3. È÷Æùæ½Ä : IR È÷ÅÍ
4. Áø°ø¾Ð : 1 pa
5. N2 »ç¿ë°¡´É
6. Siemens PLC ÄÁÆ®·Ñ ½Ã½ºÅÛ
7. ¿ÂµµÆíÂ÷ : +/- 1 ¡É
8. Ä«¸Þ¶ó ¸ð´ÏÅ͸µ ºÐ¼® ½Ã½ºÅÛ (op)
9. Æ÷¸§»ê (Formic, ¸Þź»ê, °³¹Ì»ê)À» ÀÌ¿ëÇÑ Ç÷°½º¸®½º. (op)
No Áø°ø vs Áø°ø ¼Ö´õ¸µ Ç°Áú ºñ±³
Æ÷¸§»ê ¹Ì»ç¿ë vs Æ÷¸§»ê »ç¿ë Ç°Áú ºñ±³
»êÈµÈ ÄíÆÛ Æеå vs Formic Acid »ç¿ë Æеå
VC2 ½Ã½ºÅÛ
1. ¸ð´ÏÅ͸µ : »ó´Ü À©µµ¿ì¸¦ ÀÌ¿ëÇØ ½Ç½Ã°£À¸·Î ¼Ö´õ¸µ °üÂû°¡´É (Ä«¸Þ¶ó op)
2. È÷Æà ½Ã½ºÅÛ : È÷Æà ÄÁÆ®·Ñ ½Ã½ºÅÛÀ¸·Î ·Îµù ½ºÅ×ÀÌ¼Ç ¿Âµµ¸¦ Á¤¹ÐÇÏ°Ô Á¦¾î
3. Áø°ø ½Ã½ºÅÛ : °í¼Ó ȸÀü½Ä Áø°ø ÆßÇÁ¸¦ ÀÌ¿ëÇÏ¿©, ºü¸¥ 1pa µµ´Þ
4. ³Ã°¢ ½Ã½ºÅÛ : ºü¸¥ Äð¸µÀ» º¸ÀåÇÏ´Â ¼ö³Ã½Ä Ä¥·¯ ³Ã°¢ ½Ã½ºÅÛÁö¿ø
5. ¼ÒÇÁÆ®¿þ¾î : ¿Âµµ ±×·¡ÇÁÀÇ µð½ºÇ÷¹ÀÌ, ¼öÁ¤, º¯°æ ¹× ¿¹¾à±â´ÉÀ¸·Î È÷Æðú Äð¸µ
6. Á¦¾î ½Ã½ºÅÛ : È÷Æà ±×·¡ÇÁ, Áø°ø, Äð¸µµî µ¶¸³Àû ¼³Á¤°¡´ÉÇϸç, ¿øŬ¸¯ Á¦¾î°¡´É
7. µ¥ÀÌÅÍ ·¹ÄÚµù ½Ã½ºÅÛ : ½Ç½Ã°£ ¸ð´ÏÅ͸µ, ¿ÂµµÁ¦¾î ±×·¡ÇÁ ÀúÀå, °øÁ¤ ÆĶó¹ÌÅÍ ÀúÀå ¹× Àåºñ ÆĶó¹ÌÅÍ ±â·Ï ¸ð´ÏÅ͸µ ¹× µ¥ÀÌÅÍ ·¹ÄÚµù ½Ã½ºÅÛ. (op)
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VC2´Â VC4¿Í ¸¶Âù°¡Áö·Î ÄÞÆÑÆ®ÇÑ »çÀÌÁî·Î, ¾ç»êÀÌ ¾Æ´Ñ Lab, ¿¬±¸°³¹ß, ½Å¼ÒÀç °³¹ßµîÀÇ ¾÷¹«¿¡ ÀûÇÕÇÕ´Ï´Ù.
¢º ¾ç»êÀº in line ÀÛ¾÷ÀÌ °¡´ÉÇÑ VCI 30. VCI40, VCI 8/10L µîÀÇ ¸ðµ¨¼±ÅÃÀÌ ÀûÇÕÇÕ´Ï´Ù. Pallet return ±â´ÉÀ» ¼±ÅÃÇÒ ¼ö ÀÖ½À´Ï´Ù.
Àû¿ëºÐ¾ß
½Å¼ÒÀç °³¹ß, IGBT ¸ðµâ, MEMS ÆÐŰ¡, °íÀü·Â ºÎÇ° ÆÐŰ¡, ±¤Àü ºÎÇ° ÆÐŰ¡, ÀüÀå ºÎÇ°, PCB, BGA, MMIC ÇÏÀ̺긮µå ÆÐŰ¡, LED Çø³Ä¨ ¼Ö´õ¸µ, ¸¶ÀÌÅ©·Î LED, MINI LEDµîÀÇ º¸ÀÌµå °¨¼Ò ¹× °íÇ°Áú ¼Ö´õ¸µÀÌ ÇÊ¿äÇÑ ºÐ¾ß.
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È÷Æà Ç÷¹ÀÌÆ® »çÁø + ¿Âµµ ÇÁ·ÎÆÄÀÏ ¼¾¼
ÀÛ¾÷ÀÚÀÇ Æí¾ÈÇÑ ÀÛ¾÷À» À§ÇÑ »ó/ÇÏ ºÎµå·¯¿î ¸®ÇÁÆà ¹æ½Ä
< ºü¸¥ Äð¸µÀÌ °¡´ÉÇÑ ¼ö³Ã½Ä Ä¥·¯ ½Ã½ºÅÛ ±âº» Á¦°ø>
VC½Ã¸®Áî Á¦Ç°
25°³ÀÌ»óÀÇ ¹ß¸í ƯÇã, ½Ç¿ë½Å¾È ƯÇã 20°Ç, ¼ÒÇÁÆ®¿þ¾î ƯÇã, µðÀÚÀÎƯÇã SiC Àº¼Ò°á Àåºñ ½Ã¸®Áî . ¿þÀÌÆÛ ·¹º§ÀÇ Æ÷¸§»ê Áø°ø ¸®ÇÃ·Î¿ì ¼Ö´õ¸µ
IGBT, MEMS ÆÐŰ¡, °íÀü·Â ºÎÇ°, Micro LED, LED Bare chipµî ³Î¸® »ç¿ëµÇ´Â Àåºñ.
3 Zone, 4 Zone Vacuum reflow ¼±Åà °¡´É VCI 30/VCI 40
Easy Operating °¡´ÉÇÑ ¿î¿µ Menu
Heating ¿ ÀüµµÀ²ÀÌ ³ôÀº IR ¹æ½ÄÀÇ Heating
¼³Á¤¿Âµµ¿¡ ºü¸£°Ô µµ´ÞµÇ´Â °í ÆÄ¿ö Heating Àåºñ
VC Áø°ø¸®Ç÷οì Application
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IGBT ÆÄ¿ö µð¹ÙÀ̽º, ´ÙÀÌ¿Àµå, Áø°ø°ü, TO ÆÐÅ°Áö, ±¤ÀüÁö µð¹ÙÀ̽º
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MMIC È¥ÇÕ È¸·Î ÆÐÅ°Áö, ¸¶ÀÌÅ©·Î¿þÀÌºê ¸ðµâ, ÇÇ´õ ¿ÉƼÄà µð¹ÙÀ̽º ÆÐÅ°Áö, ±Ý¹ÚĨ À£µù
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Advanced FC-BGA ÆÐŰ¡, ÅëÇÕȸ·Î(integrate circuit), MEMS µð¹ÙÀ̽º
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ÀÚµ¿Â÷ ÀüÀÚ µð¹ÙÀ̽º, ÆÄ¿ö¸ðµâ ÆÐÅ°Áö, µå¶óÀÌºê ¸ðµâ
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¿¡¾î¹ëºê ¾Á, ºê¸´Áö À£µù
LED Çø³Ä¨(Flip Chip), Mini LED, Micro LED, UV LED, ÀÚµ¿Â÷ ¶óÀÌÆ®µî
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