High precision dispensing system + Musashi MC-5000XII controller
or High precision dispensing system + BCB KD-65 controller
Conveyor System
Multiple Segment with Independent Driver
Size of Carrier
Max. 460mm x 350mm x 20mm (Thickness = Carrier + Object)
Conveyor Through
Left to Right
Feeding Forms
Wafer Flange, Tray Form, & Tape Feeder is available
(1) Auto-Wafer Changer
Selectable 12" / 8" / 6" Wafer Die Flange auto-loading (12" is optional)
for dies pickup area max. 200 x 200mm on flange
8" to 6" / 12" to 6" Wafer Flange Adapter is available (optional)
Flange Cassette capacity is max. 25 pcs and support max. 25 types of wafer flange auto-loading and placement
Wafer Die map-data is available to system programming
(2) Auto-Tray Changer
Each Tray Cassette with 8 slots for tray carriers
Size capacity up to 250mm x 120mm in each tray carrier, or two pieces of 120mm x 120mm waffle tray place on, and enough carrier clearance for max. 10 mm height of component placing
Support max. 8 types of (tray) components for auto-loading and placement
(3) Tape Feeder Platform
Max. 12 slots of 8mm Std. SMT tape feeder on the feeder platform, compatible with 8mm/12mm/16mm/24mm Std. SMT tape feeder
FD-20 / FD-30 type Solder-preform Tape Feeder is optional
The corresponding specifications for solder-preform size is:
(FD-20) W 2mm~20mm, L 0mm~20mm / (FD-30) W 2mm~30mm, L 0mm~20mm